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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

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Good quality Single Pass Honing Tools for sales
Good quality Single Pass Honing Tools for sales
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The last purchase stone was good performing and long life, so please send same quality and speciation,we will increase order.

—— S.Sasikumar

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—— Dexter Lucky Maligang

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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

China Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding supplier
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding supplier Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding supplier Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding supplier Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding supplier

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Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-BGW

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: Price can be negotiated
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Name: Silicon Wafer Back Grinding Wheels Applications: Semiconductor Silicon
Space Code: 6A2 Or 14A1 Finishing: Nitride
Body: STEEL Place Of Origin: China (Mainland)
Brand Name: Hongtuo Structure: With Flange Or Without
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Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding

 

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

 

Silicon Wafer Back Grinding Wheel

 

This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

 

Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

 

Processes: Back to front rough and fine grinding

 

Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.

 

Work Piece Materials: Monocrystalline silicon and other semiconductor materials.

 

Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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