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Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

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Good quality Single Pass Honing Tools for sales
Good quality Single Pass Honing Tools for sales
Customer Reviews
The last purchase stone was good performing and long life, so please send same quality and speciation,we will increase order.

—— S.Sasikumar

We will concentrate to promote Hongtou Blades as we have a reference already with the quality over the years.

—— Dexter Lucky Maligang

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Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency supplier
Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency supplier Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency supplier Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency supplier

Large Image :  Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-CT

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: price negotiable
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Using: Back Grinding Machines, Dicing Saws Flatness: High
Parallelism: Depth Dress: Easy To Dress
Size: 2, 3, 4, 5, 6, 8 And 12 Inch Feature: Durable
Planarity: 0.005 Fit For: Strasbaugh
High Light:

vacuum chuck table

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porous ceramic vacuum chuck

Wafer Back table for silicon Grinding Machines Porous Chuck Table High planarity 12 Inch fit for Strasbaugh

 

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.

 

 

Features:

 

1 This wafer chuck provides a high flatness and depth of parallelism.
2 It is compact in structure, uniform size and high strength.
3 It features a well-distributed absorption capacity.
4 The dicing accessory is easy to dress.

 

Applications

 

2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers back grinding

 

Applicable Machines

 

Back grinding machines, dicing saws

 

Type

 

Ceramic,Metal

 

 

Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

 

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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