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LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without

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LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without

China LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without supplier
LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without supplier LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without supplier LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without supplier LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without supplier

Large Image :  LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-BGW

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: Price can be negotiated
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Name: Silicon Wafer Back Grinding Wheels Applications: Ceramich Ships, Al3O2, Semiconduction
Space Code: 6A2 Or 6A2H;6A2T Finishing: Nitride
Body: LED Substrate Place Of Origin: China (Mainland)
Brand Name: Hongtuo Structure: With Flange Or Without
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Back Grinding Wheel with LED substrate Silicon Wafer Back Grinding Wheels

 

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

 

LED Substrate Back Grinding Wheels

 

This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

 

Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

 

Application: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece material: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.

 

LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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