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HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency

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HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency

China HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency supplier
HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency supplier HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency supplier HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency supplier

Large Image :  HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-BGW

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: $50-$500
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Name: Silicon Wafer Back Grinding Wheels Applications: Sapphire Epitaxial Wafer,silicon Wafer,gallium Arsenide And GaN Wafer
Space Code: 6A2 Or 6A2H;6A2T Size: Cuestomer Requirements
Using: Semiconductor Silicon Body: LED Substrate
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HT-BGW Glass Grinding Wheel For Gallium Arsenide GaN Wafer High Efficiency

 

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

1. Silicon Wafer Back Grinding Wheel

This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

Work Piece Materials: Monocrystalline silicon and other semiconductor materials

Processes: Back to front rough and fine grinding

2. LED Substrate Back Grinding Wheels

This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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