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Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade

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Good quality Single Pass Honing Tools for sales
Good quality Single Pass Honing Tools for sales
Customer Reviews
The last purchase stone was good performing and long life, so please send same quality and speciation,we will increase order.

—— S.Sasikumar

We will concentrate to promote Hongtou Blades as we have a reference already with the quality over the years.

—— Dexter Lucky Maligang

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Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade

China Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade supplier
Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade supplier Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade supplier Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade supplier Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade supplier

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Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-YB

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: price negotiable
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Name: Electroplated Bond Blades With Hub Type: Hardblade,thin
Specification: HT-YB Bond: ABCDS
Size: Customize Application: Silicon Wafers,gallium Arsenide,gallium Phosphide
High Light:

dicing saw blade

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disco dicing blades

Electroplated bond diamond blades Hub Blade with Hub HT-YB series

 

 

The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and imported equipment. The diamond blade is made using an ultra-thin diamond wheel and a high precision aluminum alloy hub in a one-step molding and electroplating process.

This type of electrohub blade – also known as a diamond saw blade with hub — comes with a high cutting efficiency and a stable cutting quality. By adjusting the blade strength, negative results such as an S-shaped cutting and blade damage and be prevented.

For more super abrasives and tools, please continue browsing the web pages or contact us directly.

Features:

1. This dicing blade has a high toughness and precision, an ultra-thin body, a long service life, and is easy to operate.

2. It can carry out difficult bevel cutting and step cutting processes.

3. Blade changing and overall maintenance time has been reduced.

4. The diamond abrasive blade comes with a combination of multi-sized abrasive particles and different binding agents, in order to meet carious processing requirements.

Applications of the Diamond Abrasive Blade

Silicon (Si) wafer, Gallium Arsenide, Gallium Phosphide, and Gallium Arsenide Phosphide

Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade

 

 

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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