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Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

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Good quality Single Pass Honing Tools for sales
Good quality Single Pass Honing Tools for sales
Customer Reviews
The last purchase stone was good performing and long life, so please send same quality and speciation,we will increase order.

—— S.Sasikumar

We will concentrate to promote Hongtou Blades as we have a reference already with the quality over the years.

—— Dexter Lucky Maligang

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Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

China Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics supplier
Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics supplier Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics supplier Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics supplier

Large Image :  Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-RE

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: Price negotiable
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Dicing Objects: Optical Glass, Ceramics, Ferrites, Crystals Size: Customize
Abrasive: Diamond Bond: Electroplated
Thicness: 0.16mm Color: Grey
High Light:

wafer dicing saw

,

disco dicing blades

Electroplated bond HUb blades for silicon wafer,wafer compounds,ceramic

 

 

HT series of dicing blades cutting blade is high performance and high quality priduction with new electroforming technology made,can be widely applied in semiconductor wafer,semiconductor resistor,cerami,plastic sealing material.

 

Free samples available

 

Features

 

 

1.ultra thin design,can be used to deepen cutting and slotting precessing.

blade thickness range of 0.015mm -0.3mm.

 

Applications

silicon wafer,wafer compounds,ceramic ,sealed plastic materials,

 

Related Technical Parameters

O.D Thickness I.D
Size Tolerance Size Standard tolerance High precision tolerance Size Tolerance
50~ 100 +0.02 0.1~≤ 0.15 ±0.005   25.4
30
31.75
40
60
80
88.9
+0.02~ 0
0.15~≤ 0.25 ±0.005 ±0.003
>0.25 ±0.01 ±0.005

 

more pictures for you review

 

Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , CeramicsElectroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

 

 

 

 

 

 

 

 

 

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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