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Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate

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Good quality Single Pass Honing Tools for sales
Good quality Single Pass Honing Tools for sales
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The last purchase stone was good performing and long life, so please send same quality and speciation,we will increase order.

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Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate

China Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate supplier
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate supplier Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate supplier Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate supplier Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate supplier

Large Image :  Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015&ISO16949
Model Number: HT-WSB

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: Price can be negotiated
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/C,T/T
Supply Ability: 500/pcs per month
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Detailed Product Description
Type: Saw Blade Finishing: Nitride
Size: 50-100mm Eletroplated: Nickel
Application: Silicon. GasAs, Gap. LiTa03 Thickness: 0.015mm-0.1mm
High Light:

diamond wafering blade

,

disco saw blades

Saw blade with diamond plated

 

If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools, please browse the other pages.

Features:

1. The ultra-thin design allows the circular blade to be used for deep cutting and slotting.

2. The blade thickness ranges from 0.015mm to 0.3mm.

3. Thanks to a combination of multiple specifications of diamond particles and various bonds, these electroformed dicing blades can be used for cutting and slotting compound semiconductors, silicon wafers and ceramic wafers.

Applicable Materials:

Silicon wafer, compound wafer with gallium arsenide, gallium phosphide, ceramics, lithium niobate, lithium tantalite and more.

Specifications:

 

**NOTE: The contents in the above picture provide relevant specifications for the electroformed bond blades. During the purchasing, please tell us all related factors so we can communicate and find the right product for you.

Technical Parameters of Electroformed Bond Blades

O.D Thickness I.D
Size Tolerance Size Standard tolerance High precision tolerance Size Tolerance
50~ 100 +0.02 0.1~≤ 0.15 ±0.005   25.4
30
31.75
40
60
80
88.9
+0.02~ 0
0.15~≤ 0.25 ±0.005 ±0.003
>0.25 ±0.01 ±0.005

 

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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