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Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series

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Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series

China Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series supplier
Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series supplier Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series supplier Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series supplier Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series supplier

Large Image :  Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series

Product Details:

Place of Origin: China
Brand Name: HT
Certification: ISO9001:2015
Model Number: HT-YH

Payment & Shipping Terms:

Minimum Order Quantity: 2
Price: Price negotiable
Packaging Details: Carton Box
Delivery Time: 2-3weeks
Payment Terms: T/T
Supply Ability: 300/pcs per month
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Detailed Product Description
Application: Alloy Frame Plastic Boards, Ceramic Wafers Size: Customize
Series: HT-YH Grit Size: Customize
Slot Qty: Customize Bond: A,B,C,D,S
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wafer dicing saw

Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series

 

The HT-YH hub dicing blade was independently developed by Hongtuo using international advanced technology. The diamond cutting blade can effectively prevent different blade, providing customers with a stable dicing operation. According to a customer’s individual requirements, we can offer professional designs for these cutting saw blades. Before designing however, please provide the relevant parameters about materials, dicing speed, spindle speed, quality requirements, dicing depth and all other related information.

 

Features:

1. In comparison to dicing blades with a thickness of less than 60μm, this blade comes with a higher strength and a longer service life.

2. The ultra-thin cut-off wheel features a great chip removal and cooling performance.

3. Processed using the electroplated dicing blade with a hub, the work piece is burr free.

Applications of the Hub Dicing Blade

This particular type of dicing blade is ideally suited for cutting epoxy resin boards, alloy frame plastic boards, ceramic wafers, composite plates with a sandwich, BGA and more.

Specifications

Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA HT-YH Series

 

 

Contact Details
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Contact Person: Mr. Ma

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